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Proceedings Paper

Silicon wafer directly used as an output coupler in Tm:YAP laser
Author(s): Xikui Ren; Chenlin Du; Li Yu; Junqing Zhao; Yewang Chen; Shuangchen Ruan
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Paper Abstract

A high power diode-pumped continuous-wave Tm:YAP laser with a piece of silicon chip as the output coupler (Si-OC) is demonstrated. A maximum output power of 13 W with a beam quality of M2 ≤ 1.45 at 1931 nm was obtained, corresponding to an optical-to-optical efficiency of 31%, and a slope efficiency of 33%. To our best knowledge, this is the first report of utilizing silicon as a output coupler on solid Tm:YAP laser system. The mechanism of silicon output coupler on Tm:YAP laser is also discussed in this letter. Because of the intriguing characteristics of silicon, such as high damage threshold, low cost and long-pass filter property, double-sided polishing single crystal silicon chip can perform as a good output coupler in high power laser system near 2 μm region.

Paper Details

Date Published: 20 February 2017
PDF: 6 pages
Proc. SPIE 10328, Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics, 103280E (20 February 2017); doi: 10.1117/12.2270458
Show Author Affiliations
Xikui Ren, Shenzhen Univ. (China)
Chenlin Du, Shenzhen Univ. (China)
Li Yu, Shenzhen Univ. (China)
Junqing Zhao, Shenzhen Univ. (China)
Yewang Chen, Shenzhen Univ. (China)
Shuangchen Ruan, Shenzhen Univ. (China)


Published in SPIE Proceedings Vol. 10328:
Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics
T. Goji Etoh; Hiroyuki Shiraga, Editor(s)

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