Share Email Print
cover

Proceedings Paper

Multispectral very wide-view sensing concept
Author(s): A. O. Boryssenko
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Major features and system-level design considerations for 3-D array apertures with hemispherical coverage are presented. First, an ideal 3-D dome-like hemispherical aperture is simulated using physical optics. Second, 3-D smooth aperture shape is approximated by several planar facets each presenting identical 2-D aperture arrays. Optimal division of hemispherical field of view into sectors of regards with similar maximum angular scan extent is discussed along with optimization of major electrical features of planar array facets, their number and total component count.

Paper Details

Date Published: 4 May 2017
PDF: 7 pages
Proc. SPIE 10185, Cyber Sensing 2017, 101850B (4 May 2017); doi: 10.1117/12.2267702
Show Author Affiliations
A. O. Boryssenko, Nuvotronics, LLC (United States)


Published in SPIE Proceedings Vol. 10185:
Cyber Sensing 2017
Igor V. Ternovskiy; Peter Chin, Editor(s)

© SPIE. Terms of Use
Back to Top