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Proceedings Paper

Shear sensing in bonded composites with cantilever beam microsensors and dual-plane digital image correlation
Author(s): Jeffery W. Baur; Keith Slinker; Corey Kondash
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Paper Abstract

Understanding the shear strain, viscoelastic response, and onset of damage within bonded composites is critical to their design, processing, and reliability. This presentation will discuss the multidisciplinary research conducted which led to the conception, development, and demonstration of two methods for measuring the shear within a bonded joint – dualplane digital image correlation (DIC) and a micro-cantilever shear sensor. The dual plane DIC method was developed to measure the strain field on opposing sides of a transparent single-lap joint in order to spatially quantify the joint shear strain. The sensor consists of a single glass fiber cantilever beam with a radially-grown forest of carbon nanotubes (CNTs) within a capillary pore. When the fiber is deflected, the internal radial CNT array is compressed against an electrode within the pore and the corresponding decrease in electrical resistance is correlated with the external loading. When this small, simple, and low-cost sensor was integrated within a composite bonded joint and cycled in tension, the onset of damage prior to joint failure was observed. In a second sample configuration, both the dual plane DIC and the hair sensor detected viscoplastic changes in the strain of the sample in response to continued loading.

Paper Details

Date Published: 5 April 2017
PDF: 10 pages
Proc. SPIE 10170, Health Monitoring of Structural and Biological Systems 2017, 1017006 (5 April 2017); doi: 10.1117/12.2264361
Show Author Affiliations
Jeffery W. Baur, Air Force Research Lab. (United States)
Keith Slinker, Air Force Research Lab. (United States)
Universal Technology Corp. (United States)
Corey Kondash, Air Force Research Lab. (United States)
Universal Technology Corp. (United States)


Published in SPIE Proceedings Vol. 10170:
Health Monitoring of Structural and Biological Systems 2017
Tribikram Kundu, Editor(s)

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