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Proceedings Paper

Spin-on metal oxide materials for N7 and beyond patterning applications
Author(s): G. Mannaert; E. Altamirano-Sanchez; T. Hopf; F. Sebaai; C. Lorant; C. Petermann; S.-E. Hong; S. Mullen; E. Wolfer; D. Mckenzie; H. Yao; D. Rahman; J.-Y. Cho; M. Padmanaban; D. Piumi
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Paper Abstract

There is a growing interest in new spin on metal oxide hard mask materials for advanced patterning solutions both in BEOL and FEOL processing. Understanding how these materials respond to plasma conditions may create a competitive advantage. In this study patterning development was done for two challenging FEOL applications where the traditional Si based films were replaced by EMD spin on metal oxides, which acted as highly selective hard masks. The biggest advantage of metal oxide hard masks for advanced patterning lays in the process window improvement at lower or similar cost compared to other existing solutions.

Paper Details

Date Published: 7 April 2017
PDF: 8 pages
Proc. SPIE 10149, Advanced Etch Technology for Nanopatterning VI, 101490T (7 April 2017); doi: 10.1117/12.2264323
Show Author Affiliations
G. Mannaert, IMEC (Belgium)
E. Altamirano-Sanchez, IMEC (Belgium)
T. Hopf, IMEC (Belgium)
F. Sebaai, IMEC (Belgium)
C. Lorant, IMEC (Belgium)
C. Petermann, Merck Performance Materials (Belgium)
S.-E. Hong, Merck Performance Materials (Belgium)
S. Mullen, EMD Performance Materials Corp. (United States)
E. Wolfer, EMD Performance Materials Corp. (United States)
D. Mckenzie, EMD Performance Materials Corp. (United States)
H. Yao, EMD Performance Materials Corp. (United States)
D. Rahman, EMD Performance Materials Corp. (United States)
J.-Y. Cho, EMD Performance Materials Corp. (United States)
M. Padmanaban, EMD Performance Materials Corp. (United States)
D. Piumi, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10149:
Advanced Etch Technology for Nanopatterning VI
Sebastian U. Engelmann, Editor(s)

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