Share Email Print

Proceedings Paper

Three-dimensional metrology for printed electronics
Author(s): Vadim Bromberg; Kevin Harding
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Novel materials and printing technologies can enable rapid and low cost prototyping and manufacturing of electronic devices with increased flexibility and complexity. However, robust and on-demand printing of circuits will require accurate metrology methods that can measure micron level patterns to verify proper production. This paper presents an evaluation of a range of optical gaging tools ranging from confocal to area 3D systems to determine metrological capability for a range of key parameters from trace thickness to solder paste volumes. Finally, this paper will present a select set of optimized measurement tools detailing both capabilities and gaps in the available technologies needed to fully realize the potential of printed electronics.

Paper Details

Date Published: 1 May 2017
PDF: 9 pages
Proc. SPIE 10220, Dimensional Optical Metrology and Inspection for Practical Applications VI, 102200I (1 May 2017); doi: 10.1117/12.2263475
Show Author Affiliations
Vadim Bromberg, GE Global Research (United States)
Kevin Harding, GE Global Research (United States)

Published in SPIE Proceedings Vol. 10220:
Dimensional Optical Metrology and Inspection for Practical Applications VI
Kevin G. Harding; Song Zhang, Editor(s)

© SPIE. Terms of Use
Back to Top