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Proceedings Paper

An electro-dynamic 3-dimensional vibration test bed for engineering testing
Author(s): Mohammadsadegh Saadatzi; Mohammad Nasser Saadatzi; Riaz Ahmed; Sourav Banerjee
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Paper Abstract

Primary objective of the work is to design, fabrication and testing of a 3-dimensional Mechanical vibration test bed. Vibration testing of engineering prototype devices in mechanical and industrial laboratories is essential to understand the response of the envisioned model under physical excitation conditions. Typically, two sorts of vibration sources are available in physical environment, acoustical and mechanical. Traditionally, test bed to simulate unidirectional acoustic or mechanical vibration is used in engineering laboratories. However, a device may encounter multiple uncoupled and/or coupled loading conditions. Hence, a comprehensive test bed in essential that can simulate all possible sorts of vibration conditions. In this article, an electrodynamic vibration exciter is presented which is capable of simulating 3-dimensional uncoupled (unidirectional) and coupled excitation, in mechanical environments. The proposed model consists of three electromagnetic shakers (for mechanical excitation). A robust electrical control circuit is designed to regulate the components of the test bed through a self-developed Graphical User Interface. Finally, performance of the test bed is tested and validated using commercially available piezoelectric sensors.

Paper Details

Date Published: 4 April 2017
PDF: 7 pages
Proc. SPIE 10166, Industrial and Commercial Applications of Smart Structures Technologies 2017, 101660D (4 April 2017); doi: 10.1117/12.2263356
Show Author Affiliations
Mohammadsadegh Saadatzi, Univ. of South Carolina (United States)
Mohammad Nasser Saadatzi, Univ. of Louisville (United States)
Riaz Ahmed, Univ. of South Carolina (United States)
Sourav Banerjee, Univ. of South Carolina (United States)


Published in SPIE Proceedings Vol. 10166:
Industrial and Commercial Applications of Smart Structures Technologies 2017
Dan J. Clingman, Editor(s)

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