Share Email Print
cover

Proceedings Paper

Thermal analysis of fused deposition modeling process using infrared thermography imaging and finite element modeling
Author(s): Xunfei Zhou; Sheng-Jen Hsieh
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

After years of development, Fused Deposition Modeling (FDM) has become the most popular technique in commercial 3D printing due to its cost effectiveness and easy-to-operate fabrication process. Mechanical strength and dimensional accuracy are two of the most important factors for reliability of FDM products. However, the solid-liquid-solid state changes of material in the FDM process make it difficult to monitor and model. In this paper, an experimental model was developed to apply cost-effective infrared thermography imaging method to acquire temperature history of filaments at the interface and their corresponding cooling mechanism. A three-dimensional finite element model was constructed to simulate the same process using element "birth and death" feature and validated with the thermal response from the experimental model. In 6 of 9 experimental conditions, a maximum of 13% difference existed between the experimental and numerical models. This work suggests that numerical modeling of FDM process is reliable and can facilitate better understanding of bead spreading and road-to-road bonding mechanics during fabrication.

Paper Details

Date Published: 5 May 2017
PDF: 14 pages
Proc. SPIE 10214, Thermosense: Thermal Infrared Applications XXXIX, 1021409 (5 May 2017); doi: 10.1117/12.2262796
Show Author Affiliations
Xunfei Zhou, Texas A&M Univ. (United States)
Sheng-Jen Hsieh, Texas A&M Univ. (United States)


Published in SPIE Proceedings Vol. 10214:
Thermosense: Thermal Infrared Applications XXXIX
Paolo Bison; Douglas Burleigh, Editor(s)

© SPIE. Terms of Use
Back to Top