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Proceedings Paper

Electron beam throughput from raster to imaging
Author(s): Marek Zywno
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Paper Abstract

Two architectures of electron beam tools are presented: single beam MEBES Exara designed and built by Etec Systems for mask writing, and the Reflected E-Beam Lithography tool (REBL), designed and built by KLA-Tencor under a DARPA Agreement No. HR0011-07-9-0007. Both tools have implemented technologies not used before to achieve their goals. The MEBES X, renamed Exara for marketing purposes, used an air bearing stage running in vacuum to achieve smooth continuous scanning. The REBL used 2 dimensional imaging to distribute charge to a 4k pixel swath to achieve writing times on the order of 1 wafer per hour, scalable to throughput approaching optical projection tools. Three stage architectures were designed for continuous scanning of wafers: linear maglev, rotary maglev, and dual linear maglev.

Paper Details

Date Published: 22 December 2016
PDF: 9 pages
Proc. SPIE 10175, Electron Technology Conference 2016, 1017503 (22 December 2016); doi: 10.1117/12.2262318
Show Author Affiliations
Marek Zywno, Silicon Valley Ventures (United States)


Published in SPIE Proceedings Vol. 10175:
Electron Technology Conference 2016
Barbara Swatowska; Wojciech Maziarz; Tadeusz Pisarkiewicz; Wojciech Kucewicz, Editor(s)

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