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Adhesion enhancement methods for a roll-to-sheet fabrication process of DE stack-transducers and their influences on the electric properties
Author(s): Helge Bochmann; Benedikt von Heckel; Jürgen Maas
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Paper Abstract

Transducers made of dielectric elastomers (DE) offer versatile opportunities for many different applications. To gain large strains and forces a multilayer topology is commonly used. DE stack-transducers represent one multilayer topology and can be operated as a sensor, a generator or an actuator simultaneously. They are made of many layers of DE films, like silicone (PDMS) and polyurethane (PUR), stacked on top of each other. The single layers are several micrometers thin and coated with a compliant electrode on both sides. Depending on the application a DE transducer has to withstand tensile forces, which may lead to a delamination of the layers and a ripping of the stack-transducer. This can be prevented by enhancing the adhesion among the layers. Within this contribution a surface plasma jet treatment with an atmospheric plasma beam as well as an adhesive utilized as electrode material was investigated to obtain an adhesion enhancement. The effects of these methods to enhance the adhesion are introduced briefly. Furthermore, various investigations were made to determine the benefits of the enhancement methods with respect to the electromechanical properties of the electrode. Therefore, certain tests regarding the surface resistance of the electrode and the dielectric breakdown strength (DBS) of the DE film were conducted. The tests indicate that the influences are strongly dependent on the composition of the electrode and the used DE material. Finally, improvements for a dry deposition roll-to-sheet manufacturing process for DE stack-transducers are derived from the obtained results.

Paper Details

Date Published: 17 April 2017
PDF: 9 pages
Proc. SPIE 10163, Electroactive Polymer Actuators and Devices (EAPAD) 2017, 101632P (17 April 2017); doi: 10.1117/12.2261096
Show Author Affiliations
Helge Bochmann, Technische Univ. Berlin (Germany)
Benedikt von Heckel, Technische Univ. Berlin (Germany)
Jürgen Maas, Technische Univ. Berlin (Germany)


Published in SPIE Proceedings Vol. 10163:
Electroactive Polymer Actuators and Devices (EAPAD) 2017
Yoseph Bar-Cohen, Editor(s)

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