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Proceedings Paper

Metrology capabilities and needs for 7nm and 5nm logic nodes
Author(s): Benjamin Bunday; Eric Solecky; Alok Vaid; A. F. Bello; Xintuo Dai
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Paper Abstract

This paper will provide a high level overview of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic applications. First, we will take a broad view of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. Commonalities and differences among the various applications will be shown. We will then report on the gating technical limits of the most important of these metrology solutions to address the metrology challenges of future nodes, highlighting key metrology technology gaps requiring industry attention and investment

Paper Details

Date Published: 28 March 2017
PDF: 41 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450G (28 March 2017); doi: 10.1117/12.2260870
Show Author Affiliations
Benjamin Bunday, GLOBALFOUNDRIES Inc. (United States)
Eric Solecky, GLOBALFOUNDRIES Inc. (United States)
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
A. F. Bello, GLOBALFOUNDRIES Inc. (United States)
Xintuo Dai, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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