Share Email Print
cover

Proceedings Paper

Optical metrology strategies for inline 7nm CMOS logic product control
Author(s): Michael Lenahan; Sridhar Mahendrakar; Alok Vaid; Taher Kagalwala; Kartik Venkataraman; Dawei Hu; Ming Di; Da Song; Janay Camp; Zhou Ren; Nam Hee Yoon
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper we propose a “film on grating” (FoG) measurement technique using spectroscopic ellipsometry (SE) that can enable sub-Ångstrom level precision for multi-layer film thickness measurement on topographies that closely approximate the device structure. FoG follows the industry trends to 'measure what matters' and provides thickness measurement data from patterned structures that has much stronger correlation to actual device performance. We also explore the impact of deviations in the film stack that can appreciably alter the device performance. One of the key device performance metrics that we will investigate is the leakage current, which is highly sensitive to process variations or defectivity. Measuring both the thickness and the bandgap of the HK dielectric permits excellent correlation with leakage current as determined by electrical testing of the device. The ability to predict electrical parameters effectively will greatly accelerate learning cycles during process development and can enable real time product control on existing inline metrology tools.

Paper Details

Date Published: 28 March 2017
PDF: 12 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101451D (28 March 2017); doi: 10.1117/12.2260491
Show Author Affiliations
Michael Lenahan, GLOBALFOUNDRIES Inc. (United States)
Sridhar Mahendrakar, GLOBALFOUNDRIES Inc. (United States)
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Taher Kagalwala, GLOBALFOUNDRIES Inc. (United States)
Kartik Venkataraman, KLA-Tencor Corp. (United States)
Dawei Hu, KLA-Tencor Corp. (United States)
Ming Di, KLA-Tencor Corp. (United States)
Da Song, KLA-Tencor Corp. (United States)
Janay Camp, KLA-Tencor Corp. (United States)
Zhou Ren, KLA-Tencor Corp. (United States)
Nam Hee Yoon, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

© SPIE. Terms of Use
Back to Top