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Proceedings Paper

DSA patterning options for logics and memory applications
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Paper Abstract

The progress of three potential DSA applications, i.e. fin formation, via shrink, and pillars, were reviewed in this paper. For fin application, in addition to pattern quality, other important considerations such as customization and design flexibility were discussed. An electrical viachain study verified the DSA rectification effect on CD distribution by showing a tighter current distribution compared to that derived from the guiding pattern direct transfer without using DSA. Finally, a structural demonstration of pillar formation highlights the importance of pattern transfer in retaining both the CD and local CDU improvement from DSA. The learning from these three case studies can provide perspectives that may not have been considered thoroughly in the past. By including more important elements during DSA process development, the DSA maturity can be further advanced and move DSA closer to HVM adoption.

Paper Details

Date Published: 27 March 2017
PDF: 13 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014603 (27 March 2017); doi: 10.1117/12.2260479
Show Author Affiliations
Chi-Chun Liu, IBM Corp. (United States)
Elliott Franke, TEL Technology Ctr., America, LLC (United States)
Yann Mignot, Albany NanoTech (United States)
Scott LeFevre, TEL Technology Ctr., America, LLC (United States)
Stuart Sieg, IBM Corp. (United States)
Cheng Chi, IBM Corp. (United States)
Luciana Meli, IBM Corp. (United States)
Doni Parnell, Tokyo Electron Europe Ltd. (Netherlands)
Kristin Schmidt, IBM Almaden Research Ctr. (United States)
Martha Sanchez, IBM Almaden Research Ctr. (United States)
Lovejeet Singh, JSR Micro, Inc. (United States)
Tsuyoshi Furukawa, JSR Micro, Inc. (United States)
Indira Seshadri, IBM Corp. (United States)
Ekmini Anuja De Silva, IBM Corp. (United States)
Hsinyu Tsai, IBM Thomas J. Watson Research Ctr. (United States)
Kafai Lai, IBM Thomas J. Watson Research Ctr. (United States)
Hoa Truong, IBM Almaden Research Ctr. (United States)
Richard Farrell, TEL Technology Ctr., America, LLC (United States)
Robert Bruce, IBM Thomas J. Watson Research Ctr. (United States)
Mark Somervell, Tokyo Electron America, Inc. (United States)
Daniel Sanders, Tokyo Electron America, Inc. (United States)
Nelson Felix, IBM Corp. (United States)
John Arnold, IBM Corp. (United States)
David Hetzer, TEL Technology Ctr., America, LLC (United States)
Akiteru Ko, TEL Technology Ctr., America, LLC (United States)
Andrew Metz, TEL Technology Ctr., America, LLC (United States)
Matthew Colburn, IBM Corp. (United States)
Daniel Corliss, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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