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Proceedings Paper

Temperature dependence of electromechanical impedance based bond-line integrity monitoring
Author(s): Prathamesh Bilgunde; Leonard J. Bond
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Paper Abstract

Electromechanical impedance (EMI) is an important technique for bond-line integrity monitoring of adhesively bonded joints in automotive and aerospace structures. In the current work, numerical analysis of temperature sensitivity of the EMI technique is performed. The objective is to detect stiffness reduction of the adhesive in the presence of temperature and external mechanical load. Increase in the operating temperature can degrade the bonded piezoelectric material causing misinterpretation of the EMI data. EMI Signal features are numerically investigated to decouple the effect of load and temperature on the piezoelectric material in the mechanically loaded bonded joint. The computational results indicate higher dependence of EM resonance spectrum towards piezoelectric material matrix as compared to the tensile load applied on the bonded sample as the stiffness of adhesive is numerically varied.

Paper Details

Date Published: 5 April 2017
PDF: 11 pages
Proc. SPIE 10170, Health Monitoring of Structural and Biological Systems 2017, 101702Y (5 April 2017); doi: 10.1117/12.2260365
Show Author Affiliations
Prathamesh Bilgunde, Iowa State Univ. (United States)
Leonard J. Bond, Iowa State Univ. (United States)


Published in SPIE Proceedings Vol. 10170:
Health Monitoring of Structural and Biological Systems 2017
Tribikram Kundu, Editor(s)

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