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Proceedings Paper

Stitch overlap via coloring technique enables maskless via
Author(s): D. Civay; E. Laffosse
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Paper Abstract

Lithographic patterning limits can be a cost-barrier that delays advancement to new nodes. This paper introduces a cost-saving design method that enables a maskless via. Multi-patterning or coloring of a design is a technique that is used at advanced nodes to aid in patterning. Coloring allows designers to designate different patterns on one level to be printed with different masks. Stitch overlap via (SOV) is a coloring technique introduced herein. SOV utilizes via-aware coloring and a unique process flow to print a maskless via. Identification of qualifying design structures is achieved through a custom program. The program inputs the design level of the multipatterned layer and the via levels above and below to determine the coloring decomposition. Vias are a particularly challenging layer to print due to the dimensions required for these pillars. SOV is a methodology for identifying qualifying multi-patterned layouts and replacing them with a new design that enables a maskless via layer.

Paper Details

Date Published: 28 March 2017
PDF: 6 pages
Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480R (28 March 2017); doi: 10.1117/12.2258640
Show Author Affiliations
D. Civay, GLOBALFOUNDRIES Inc. (United States)
E. Laffosse, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 10148:
Design-Process-Technology Co-optimization for Manufacturability XI
Luigi Capodieci; Jason P. Cain, Editor(s)

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