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Proceedings Paper

Voiding in lead-free soldering of components with large solder pads
Author(s): Barbara Dziurdzia; Janusz Mikołajek
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Paper Abstract

The paper presents the quantification of void formation in lead-free solder joints underneath bottom terminated components (BTCs) through X-ray inspection. Experiments were designed to investigate how void formation is affected by using vacuum in reflow soldering on the example of light emitted diode (LED) packages on metal core printed circuit boards (PCBs). Convection and vapour phase reflow soldering were used for LED assembly. X-ray inspection system analyzed the statistical distribution, mean value, standard deviation and process capability value Cpk of thermal pads coverage for various technological versions of LEDs.

Paper Details

Date Published: 22 December 2016
PDF: 7 pages
Proc. SPIE 10175, Electron Technology Conference 2016, 1017506 (22 December 2016); doi: 10.1117/12.2258608
Show Author Affiliations
Barbara Dziurdzia, AGH Univ. of Science and Technology (Poland)
Janusz Mikołajek, Fideltronik Poland Ltd. (Poland)


Published in SPIE Proceedings Vol. 10175:
Electron Technology Conference 2016
Barbara Swatowska; Wojciech Maziarz; Tadeusz Pisarkiewicz; Wojciech Kucewicz, Editor(s)

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