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Proceedings Paper

Process resilient overlay target designs for advanced memory manufacture
Author(s): Joonseuk Lee; Mirim Jung; Honggoo Lee; Youngsik Kim; Sangjun Han; Michael E. Adel; Tal Itzkovich; Vladimir Levinski; Victoria Naipak; Anna Golotsvan; Amnon Manassen; Yuri Paskover; Tom Leviant; Efi Megged; Myungjun Lee; Mark D. Smith; Do-Hwa Lee; DongSub Choi; Zephyr Liu
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Paper Abstract

In recent years, lithographic printability of overlay metrology targets for memory applications has emerged as a significant issue. Lithographic illumination conditions such as extreme dipole, required to achieve the tightest possible pitches in DRAM pose a significant process window challenge to the metrology target design. Furthermore, the design is also required to track scanner aberration induced pattern placement errors of the device structure. Previous workiii, has shown that the above requirements have driven a design optimization methodology which needs to be tailored for every lithographic and integration scheme, in particular self-aligned double and quadruple patterning methods. In this publication we will report on the results of a new target design technique and show some example target structures which, while achieving the requirements specified above, address a further critical design criterion – that of process resilience.

Paper Details

Date Published: 30 March 2017
PDF: 12 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 1014524 (30 March 2017); doi: 10.1117/12.2258376
Show Author Affiliations
Joonseuk Lee, SK Hynix, Inc. (Korea, Republic of)
Mirim Jung, SK Hynix, Inc. (Korea, Republic of)
Honggoo Lee, SK Hynix, Inc. (Korea, Republic of)
Youngsik Kim, SK Hynix, Inc. (Korea, Republic of)
Sangjun Han, SK Hynix, Inc. (Korea, Republic of)
Michael E. Adel, KLA-Tencor Israel (Israel)
Tal Itzkovich, KLA-Tencor Israel (Israel)
Vladimir Levinski, KLA-Tencor Israel (Israel)
Victoria Naipak, KLA-Tencor Israel (Israel)
Anna Golotsvan, KLA-Tencor Israel (Israel)
Amnon Manassen, KLA-Tencor Israel (Israel)
Yuri Paskover, KLA-Tencor Israel (Israel)
Tom Leviant, KLA-Tencor Israel (Israel)
Efi Megged, KLA-Tencor Israel (Israel)
Myungjun Lee, KLA-Tencor Corp. (United States)
Mark D. Smith, KLA-Tencor Corp. (United States)
Do-Hwa Lee, KLA-Tencor Korea (Korea, Republic of)
DongSub Choi, KLA-Tencor Korea (Korea, Republic of)
Zephyr Liu, KLA-Tencor Korea (Korea, Republic of)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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