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Proceedings Paper

Patterning with metal-oxide EUV photoresist: patterning capability, resist smoothing, trimming, and selective stripping
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Paper Abstract

Inpria metal-oxide photoresist (PR) serves as a thin spin-on patternable hard mask for EUV lithography. Compared to traditional organic photoresists, the ultrathin metal-oxide photoresist (~12nm after development) effectively mitigates pattern collapse. Because of the high etch resistance of the metal-oxide resist, this may open up significant scope for more aggressive etches, new chemistries, and novel integration schemes. We have previously shown that metal-oxide PR can be successfully used to pattern the block layer for the imec 7-nm technology node[1] and advantageously replace a multiple patterning approach, which significantly reduces the process complexity and effectively decreases the cost. We also demonstrated the formation of 16nm half pitch 1:1 line/space with EUV single print[2], which corresponds to a metal 2 layer for the imec 7-nm technology node. In this paper, we investigate the feasibility of using Inpria’s metal-oxide PR for 16nm line/space patterning. In meanwhile, we also explore the different etch process for LWR smoothing, resist trimming and resist stripping.

Paper Details

Date Published: 27 March 2017
PDF: 9 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101460I (27 March 2017); doi: 10.1117/12.2258118
Show Author Affiliations
Ming Mao, IMEC (Belgium)
Frederic Lazzarino, IMEC (Belgium)
Peter De Schepper, Inpria Corp. (United States)
Danilo De Simone, IMEC (Belgium)
Daniele Piumi, IMEC (Belgium)
Vinh Luong, TEL Technology Ctr., America, LLC (United States)
Fumiko Yamashita, Tokyo Electron Miyagi Ltd. (Japan)
Michael Kocsis, Inpria Corp. (United States)
Kaushik Kumar, TEL Technology Ctr., America, LLC (United States)


Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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