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Proceedings Paper

Self-aligned block technology: a step toward further scaling
Author(s): Frédéric Lazzarino; Nihar Mohanty; Yannick Feurprier; Lior Huli; Vinh Luong; Marc Demand; Stefan Decoster; Victor Vega Gonzalez; Julien Ryckaert; Ryan Ryoung Han Kim; Arindam Mallik; Philippe Leray; Chris Wilson; Jürgen Boemmels; Kaushik Kumar; Kathleen Nafus; Anton deVilliers; Jeffrey Smith; Carlos Fonseca; Julie Bannister; Steven Scheer; Zsolt Tokei; Daniele Piumi; Kathy Barla
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Paper Abstract

In this work, we present and compare two integration approaches to enable self-alignment of the block suitable for the 5- nm technology node. The first approach is exploring the insertion of a spin-on metal-based material to memorize the first block and act as an etch stop layer in the overall integration. The second approach is evaluating the self-aligned block technology employing widely used organic materials and well-known processes. The concept and the motivation are discussed considering the effects on design and mask count as well as the impact on process complexity and EPE budget. We show the integration schemes and discuss the requirements to enable self-alignment. We present the details of materials and processes selection to allow optimal selective etches and we demonstrate the proof of concept using a 16- nm half-pitch BEOL vehicle. Finally, a study on technology insertion and cost estimation is presented.

Paper Details

Date Published: 7 April 2017
PDF: 10 pages
Proc. SPIE 10149, Advanced Etch Technology for Nanopatterning VI, 1014908 (7 April 2017); doi: 10.1117/12.2258028
Show Author Affiliations
Frédéric Lazzarino, IMEC (Belgium)
Nihar Mohanty, TEL Technology Ctr., America, LLC (United States)
Yannick Feurprier, TEL Technology Ctr., America, LLC (United States)
Lior Huli, TEL Technology Ctr., America, LLC (United States)
Vinh Luong, TEL Technology Ctr., America, LLC (United States)
Marc Demand, Tokyo Electron Europe Ltd. (United Kingdom)
Stefan Decoster, IMEC (Belgium)
Victor Vega Gonzalez, IMEC (Belgium)
Julien Ryckaert, IMEC (Belgium)
Ryan Ryoung Han Kim, IMEC (Belgium)
Arindam Mallik, IMEC (Belgium)
Philippe Leray, IMEC (Belgium)
Chris Wilson, IMEC (Belgium)
Jürgen Boemmels, IMEC (Belgium)
Kaushik Kumar, TEL Technology Ctr., America, LLC (United States)
Kathleen Nafus, TEL Technology Ctr., America, LLC (United States)
Anton deVilliers, TEL Technology Ctr., America, LLC (United States)
Jeffrey Smith, TEL Technology Ctr., America, LLC (United States)
Carlos Fonseca, TEL Technology Ctr., America, LLC (United States)
Julie Bannister, TEL Technology Ctr., America, LLC (United States)
Steven Scheer, TEL Technology Ctr., America, LLC (United States)
Zsolt Tokei, IMEC (Belgium)
Daniele Piumi, IMEC (Belgium)
Kathy Barla, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10149:
Advanced Etch Technology for Nanopatterning VI
Sebastian U. Engelmann, Editor(s)

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