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Proceedings Paper

Monitoring of multi-patterning processes in production environment
Author(s): Sangjun Han; Honggoo Lee; Jaesun Woo; Seungyoung Kim; Wan-Soo Kim; Stefan Buhl; Boris Habets; Seop Kim
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Paper Abstract

Multi-patterning processes have become common in the leading-edge semiconductor industry. These processes require a good patterning uniformity over the wafer while different process steps have impact. The initial lithography steps can be nearly perfect, but the CD variation after a trim process may cause CD variation after the spacer deposition. In fact, that leads to final non-uniformity of the final CD. Monitoring and controlling the individual CD parameters is not sufficient to ensure a stable process. We define a set of new KPIs, taking all contributions into account and using macro measurement data. We show that a reliable monitoring is achieved to meet the process specifications.

Paper Details

Date Published: 28 March 2017
PDF: 14 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101452M (28 March 2017); doi: 10.1117/12.2257978
Show Author Affiliations
Sangjun Han, SK Hynix, Inc. (Korea, Republic of)
Honggoo Lee, SK Hynix, Inc. (Korea, Republic of)
Jaesun Woo, SK Hynix, Inc. (Korea, Republic of)
Seungyoung Kim, SK Hynix, Inc. (Korea, Republic of)
Wan-Soo Kim, Qoniac GmbH (Germany)
Stefan Buhl, Qoniac GmbH (Germany)
Boris Habets, Qoniac GmbH (Germany)
Seop Kim, Qoniac Korea Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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