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Proceedings Paper

Novel spin on planarization technology by photo curing SOC (P-SOC)
Author(s): Takafumi Endo; Rikimaru Sakamoto; Keisuke Hashimoto; Daigo Saito; Hirokazu Nishimaki; Ryo Karasawa; Hikaru Tokunaga
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Paper Abstract

In advanced lithography technology, high planarity SOC (Spin-on-Carbon) materials which can planarize topography substrates are required in order to obtain enough process margin. We developed photo curing SOC (P-SOC) materials which can be cross-link by short wavelength UV light, but not thermal process. The P-SOC can achieve high planarization and good via filling because they have high reflow performance without viscosity increasing by baking process and almost no film shrinkage during the baking and photo curing process. The novel P-SOC materials are suitable for very fine pattern manufacturing process as N5 generation which is needed planarization technology.

Paper Details

Date Published: 27 March 2017
PDF: 7 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014625 (27 March 2017); doi: 10.1117/12.2257974
Show Author Affiliations
Takafumi Endo, Nissan Chemical Industries, Ltd. (Japan)
Rikimaru Sakamoto, Nissan Chemical Industries, Ltd. (Japan)
Keisuke Hashimoto, Nissan Chemical Industries, Ltd. (Japan)
Daigo Saito, Nissan Chemical Industries, Ltd. (Japan)
Hirokazu Nishimaki, Nissan Chemical Industries, Ltd. (Japan)
Ryo Karasawa, Nissan Chemical Industries, Ltd. (Japan)
Hikaru Tokunaga, Nissan Chemical Industries, Ltd. (Japan)


Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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