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Proceedings Paper

The use of computational inspection to identify process window limiting hotspots and predict sub-15nm defects with high capture rate
Author(s): Boo-Hyun Ham; Il-Hwan Kim; Sung-Sik Park; Sun-Young Yeo; Sang-Jin Kim; Dong-Woon Park; Joon-Soo Park; Chang-Hoon Ryu; Bo-Kyeong Son; Kyung-Bae Hwang; Jae-Min Shin; Jangho Shin; Ki-Yeop Park; Sean Park; Lei Liu; Ming-Chun Tien; Angelique Nachtwein; Marinus Jochemsen; Philip Yan; Vincent Hu; Christopher Jones
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Paper Abstract

As critical dimensions for advanced two dimensional (2D) DUV patterning continue to shrink, the exact process window becomes increasingly difficult to determine. The defect size criteria shrink with the patterning critical dimensions and are well below the resolution of current optical inspection tools. As a result, it is more challenging for traditional bright field inspection tools to accurately discover the hotspots that define the process window. In this study, we use a novel computational inspection method to identify the depth-of-focus limiting features of a 10 nm node mask with 2D metal structures (single exposure) and compare the results to those obtained with a traditional process windows qualification (PWQ) method based on utilizing a focus modulated wafer and bright field inspection (BFI) to detect hotspot defects. The method is extended to litho-etch litho-etch (LELE) on a different test vehicle to show that overlay related bridging hotspots also can be identified.

Paper Details

Date Published: 28 March 2017
PDF: 12 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101451P (28 March 2017); doi: 10.1117/12.2257964
Show Author Affiliations
Boo-Hyun Ham, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Il-Hwan Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Sung-Sik Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Sun-Young Yeo, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Sang-Jin Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Dong-Woon Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Chang-Hoon Ryu, ASML Korea Co., Ltd. (Korea, Republic of)
Bo-Kyeong Son, ASML Korea Co., Ltd. (Korea, Republic of)
Kyung-Bae Hwang, ASML Korea Co., Ltd. (Korea, Republic of)
Jae-Min Shin, ASML Korea Co., Ltd. (Korea, Republic of)
Jangho Shin, ASML Korea Co., Ltd. (Korea, Republic of)
Ki-Yeop Park, ASML Korea Co., Ltd. (Korea, Republic of)
Sean Park, ASML Brion (United States)
Lei Liu, ASML Brion (United States)
Ming-Chun Tien, ASML Brion (United States)
Angelique Nachtwein, ASML Brion (United States)
Marinus Jochemsen, ASML Brion (United States)
Philip Yan, Brion Technologies (Shenzhen) Co., Ltd. (China)
Vincent Hu, Brion Technologies (Shenzhen) Co., Ltd. (China)
Christopher Jones, ASML Brion (United States)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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