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Proceedings Paper

Application of advanced diffraction based optical metrology overlay capabilities for high-volume manufacturing
Author(s): Kai-Hsiung Chen; Guo-Tsai Huang; Hung-Chih Hsieh; Wei-Feng Ni; S. M. Chuang; T. K. Chuang; Chih-Ming Ke; Jacky Huang; Shiuan-An Rao; Aysegul Cumurcu Gysen; Maxime d'Alfonso; Jenny Yueh; Pavel Izikson; Aileen Soco; Jon Wu; Tjitte Nooitgedagt; Jeroen Ottens; Yong Ho Kim; Martin Ebert
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Paper Abstract

On-product overlay requirements are becoming more challenging with every next technology node due to the continued decrease of the device dimensions and process tolerances. Therefore, current and future technology nodes require demanding metrology capabilities such as target designs that are robust towards process variations and high overlay measurement density (e.g. for higher order process corrections) to enable advanced process control solutions. The impact of advanced control solutions based on YieldStar overlay data is being presented in this paper. Multi patterning techniques are applied for critical layers and leading to additional overlay measurement demands. The use of 1D process steps results in the need of overlay measurements relative to more than one layer. Dealing with the increased number of overlay measurements while keeping the high measurement density and metrology accuracy at the same time presents a challenge for high volume manufacturing (HVM). These challenges are addressed by the capability to measure multi-layer targets with the recently introduced YieldStar metrology tool, YS350. On-product overlay results of such multi-layers and standard targets are presented including measurement stability performance.

Paper Details

Date Published: 28 March 2017
PDF: 7 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 1014528 (28 March 2017); doi: 10.1117/12.2257894
Show Author Affiliations
Kai-Hsiung Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Guo-Tsai Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Hung-Chih Hsieh, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Wei-Feng Ni, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
S. M. Chuang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
T. K. Chuang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jacky Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Shiuan-An Rao, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Aysegul Cumurcu Gysen, ASML Netherlands B.V. (Netherlands)
Maxime d'Alfonso, ASML Netherlands B.V. (Netherlands)
Jenny Yueh, ASML Netherlands B.V. (Netherlands)
Pavel Izikson, ASML Netherlands B.V. (Netherlands)
Aileen Soco, ASML Netherlands B.V. (Netherlands)
Jon Wu, ASML Netherlands B.V. (Netherlands)
Tjitte Nooitgedagt, ASML Netherlands B.V. (Netherlands)
Jeroen Ottens, ASML Netherlands B.V. (Netherlands)
Yong Ho Kim, ASML Netherlands B.V. (Netherlands)
Martin Ebert, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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