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Proceedings Paper

Study of flowability effect on self-planarization performance at SOC materials
Author(s): Huichan Yun; Jinhyung Kim; Youjung Park; Yoona Kim; Seulgi Jeong; Jaeyeol Baek; Byeri Yoon; Sanghak Lim
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Paper Abstract

For multilayer process, importance of carbon-based spin-on hardmask material that replaces amorphous carbon layer (ACL) is ever increasing. Carbon-based spin-on hardmask is an organic polymer with high carbon content formulated in organic solvents for spin-coating application that is cured through baking. In comparison to CVD process for ACL, carbon-based spin-on hardmask material can offer several benefits: lower cost of ownership (CoO) and improved process time, as well as better gap-fill and planarization performances. Thus carbon-based spin-on hardmask material of high etch resistance, good gap-fill properties and global planarization performances over various pattern topographies are desired to achieve the fine patterning and high aspect ratio (A/R). In particular, good level of global planarization of spin coated layer over the underlying pattern topographies is important for self-aligned double patterning (SADP) process as it dictates the photolithographic margin. Herein, we report a copolymer carbon-based spin-on hardmask resin formulation that exhibits favorable film shrinkage profile and good etch resistance properties. By combining the favorable characteristics of each resin – one resin with good shrinkage property and the other with excellent etch resistance into the copolymer, it was possible to achieve a carbonbased spin-on hardmask formulation with desirable level of etch resistance and the planarization performances across various underlying substrate pattern topographies.

Paper Details

Date Published: 27 March 2017
PDF: 9 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014624 (27 March 2017); doi: 10.1117/12.2257880
Show Author Affiliations
Huichan Yun, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Jinhyung Kim, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Youjung Park, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Yoona Kim, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Seulgi Jeong, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Jaeyeol Baek, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Byeri Yoon, SAMSUNG SDI Co., Ltd. (Korea, Republic of)
Sanghak Lim, SAMSUNG SDI Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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