Share Email Print
cover

Proceedings Paper

Hotspots fixing flow in NTD process by using DTCO methodology at 10nm metal 1 layer
Author(s): Xiaojing Su; Lisong Dong; Jiaxin Lin; Ying Chen; Yayi Wei; Tianchun Ye; Chunshan Du; Feng Shao; Recco Zhang; Yu Zhu; Junjiang Lei; Minghui Fan
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper proposes a novel hotspots fixing flow, in which design rule optimization and lithography RET solution are obtained simultaneously. This flow is most effective in the early development phase, and its methodology is rooted from design technology co-optimization (DTCO). Two layout files, corresponding to separate colors of a double-pattern layer (10nm node M1), are first generated by a pattern generator, and they meet no-stitching requirements and are design rule check (DRC) clean. Then, source, mask and design rule co-optimization is done with the layouts, and the design rules are optimized to remove hotspots and enable maximum lithography process window (PW). The mask optimization (MO) in combination with cost function manipulation and design rule optimization improve the robustness of initial design rule. The application of the methodology illustrates a friendly design rule and avoids later design rework.

Paper Details

Date Published: 28 March 2017
PDF: 12 pages
Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 1014817 (28 March 2017); doi: 10.1117/12.2257786
Show Author Affiliations
Xiaojing Su, Institute of Microelectronics (China)
Lisong Dong, Institute of Microelectronics (China)
Jiaxin Lin, Univ. of Electronic Science and Technology of China (China)
Ying Chen, Institute of Microelectronics (China)
Yayi Wei, Institute of Microelectronics (China)
Univ. of Chinese Academy of Sciences (China)
Tianchun Ye, Institute of Microelectronics (China)
Univ. of Chinese Academy of Sciences (China)
Chunshan Du, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)
Feng Shao, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)
Recco Zhang, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)
Yu Zhu, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)
Junjiang Lei, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)
Minghui Fan, Mentor Graphics Shanghai Electronic Technology Co., Ltd. (China)


Published in SPIE Proceedings Vol. 10148:
Design-Process-Technology Co-optimization for Manufacturability XI
Luigi Capodieci; Jason P. Cain, Editor(s)

© SPIE. Terms of Use
Back to Top