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On-product overlay improvement with an enhanced alignment system
Author(s): Tomonori Dosho; Yuji Shiba; Takanobu Okamoto; Hajime Yamamoto; Yujiro Hikida; Jay Brown; Go Ichinose; Masahiro Morita; Yuichi Shibazaki
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Paper Abstract

The final lithography accuracy is determined by what is known as the “on-product” performance, which includes product wafer-related errors and long-term stability. It is evident that on-product performance improvement is absolutely imperative now, and will become even more crucial in coming years. In order to meet customers’ future requirements, we have developed the next-generation lithography system focusing on wafer alignment advancements to improve onproduct performance.

This newly developed wafer alignment system will help customers achieve their aggressive next-generation manufacturing accuracy and productivity requirements. In this paper, we describe the details of the new wafer measurement system and provide supporting performance data.

Paper Details

Date Published: 24 March 2017
PDF: 8 pages
Proc. SPIE 10147, Optical Microlithography XXX, 1014716 (24 March 2017); doi: 10.1117/12.2257659
Show Author Affiliations
Tomonori Dosho, Nikon Corp. (Japan)
Yuji Shiba, Nikon Corp. (Japan)
Takanobu Okamoto, Nikon Corp. (Japan)
Hajime Yamamoto, Nikon Corp. (Japan)
Yujiro Hikida, Nikon Corp. (Japan)
Jay Brown, Nikon Corp. (Japan)
Go Ichinose, Nikon Corp. (Japan)
Masahiro Morita, Nikon Corp. (Japan)
Yuichi Shibazaki, Nikon Corp. (Japan)


Published in SPIE Proceedings Vol. 10147:
Optical Microlithography XXX
Andreas Erdmann; Jongwook Kye, Editor(s)

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