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Effects of phenolic compound addition to fractionated Novolak-based resists to improve resolution capability(2)
Author(s): Atsushi Sekiguchi; Yoko Matsumoto; Yoshihisa Sensu; Satoshi Takei; Makoto Hanabata; Hatsuyuki Tanaka
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Paper Abstract

Novolak resists have been widely used in IC production and are used to this day in the production of flat panel displays (FPDs) and MEMS. However, with the advent of high-definition devices, FPDs must meet growing requirements for finer dimensions. These trends have generated requirements for higher sensitivity, higher resolution, and wider process margins for novolak resists. Using a lithography simulator with the goal of improving the performance of novolak resists, we examined various approaches to improving resist materials. This report discusses efforts to improve resolution and to broaden process margins using a novolak resin that exhibits a higher degree of fractionation than in the previous report (maximum fractionated resin) with the addition of low molecular weight phenol resins.

Paper Details

Date Published: 27 March 2017
PDF: 11 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101461K (27 March 2017); doi: 10.1117/12.2257548
Show Author Affiliations
Atsushi Sekiguchi, Litho Tech Japan Co., Ltd. (Japan)
Yoko Matsumoto, Litho Tech Japan Co., Ltd. (Japan)
Yoshihisa Sensu, Litho Tech Japan Co., Ltd. (Japan)
Satoshi Takei, Toyama Prefectural Univ. (Japan)
Makoto Hanabata, Toyama Prefectural Univ. (Japan)
Hatsuyuki Tanaka, Merck Performance Materials Manufacturing G.K. (Japan)


Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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