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Proceedings Paper

Validation of thermal effects of LED package by using Elmer finite element simulation method
Author(s): Lai Siang Leng; Vithyacharan Retnasamy; Mukhzeer Mohamad Shahimin; Zaliman Sauli; Steven Taniselass; Muhamad Hafiz Bin Ab Aziz; Rajendaran Vairavan; Supap Kirtsaeng
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Paper Abstract

The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software - Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and ParaView software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.

Paper Details

Date Published: 16 February 2017
PDF: 6 pages
Proc. SPIE 10124, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI, 101241M (16 February 2017); doi: 10.1117/12.2257216
Show Author Affiliations
Lai Siang Leng, Univ. Malaysia Perlis (Malaysia)
Vithyacharan Retnasamy, Univ. Malaysia Perlis (Malaysia)
Mukhzeer Mohamad Shahimin, National Defence Univ. of Malaysia (Malaysia)
Zaliman Sauli, Univ. Malaysia Perlis (Malaysia)
Steven Taniselass, Univ. Malaysia Perlis (Malaysia)
Muhamad Hafiz Bin Ab Aziz, Univ. Malaysia Perlis (Malaysia)
Rajendaran Vairavan, Univ Malaysia Perlis (Malaysia)
Supap Kirtsaeng, Silpakorn Univ. (Thailand)


Published in SPIE Proceedings Vol. 10124:
Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI
Jong Kyu Kim; Michael R. Krames; Li-Wei Tu; Martin Strassburg, Editor(s)

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