Share Email Print
cover

Proceedings Paper

Narrow linewidth diode laser modules for quantum optical sensor applications in the field and in space
Author(s): A. Wicht; A. Bawamia; M. Krüger; Ch. Kürbis; M. Schiemangk; R. Smol; A. Peters; G. Tränkle
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We present the status of our efforts to develop very compact and robust diode laser modules specifically suited for quantum optics experiments in the field and in space. The paper describes why hybrid micro-integration and GaAs-diode laser technology is best suited to meet the needs of such applications. The electro-optical performance achieved with hybrid micro-integrated, medium linewidth, high power distributed-feedback master-oscillator-power-amplifier modules and with medium power, narrow linewidth extended cavity diode lasers emitting at 767 nm and 780 nm are briefly described and the status of space relevant stress tests and space heritage is summarized. We also describe the performance of an ECDL operating at 1070 nm. Further, a novel and versatile technology platform is introduced that allows for integration of any type of laser system or electro-optical module that can be constructed from two GaAs chips. This facilitates, for the first time, hybrid micro-integration, e.g. of extended cavity diode laser master-oscillator-poweramplifier modules, of dual-stage optical amplifiers, or of lasers with integrated, chip-based phase modulator. As an example we describe the implementation of an ECDL-MOPA designed for experiments on ultra-cold rubidium and potassium atoms on board a sounding rocket and give basic performance parameters.

Paper Details

Date Published: 27 February 2017
PDF: 16 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850F (27 February 2017); doi: 10.1117/12.2253655
Show Author Affiliations
A. Wicht, Ferdinand-Braun-Institut (Germany)
Humboldt-Univ. zu Berlin (Germany)
A. Bawamia, Ferdinand-Braun-Institut (Germany)
M. Krüger, Ferdinand-Braun-Institut (Germany)
Ch. Kürbis, Ferdinand-Braun-Institut (Germany)
M. Schiemangk, Ferdinand-Braun-Institut (Germany)
R. Smol, Ferdinand-Braun-Institut (Germany)
A. Peters, Ferdinand-Braun-Institut (Germany)
Humboldt-Univ. zu Berlin (Germany)
G. Tränkle, Ferdinand-Braun-Institut (Germany)


Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)

© SPIE. Terms of Use
Back to Top