Share Email Print
cover

Proceedings Paper

Robust adhesive precision bonding of laser optics II (Conference Presentation)
Author(s): Tobias Müller; Andreas Beleke; Sebastian Haag; Daniel Zontar; Sebastian Sauer; Christoph Baum; Christian Brecher; Christian Wenzel
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Laser systems face massive economic challenges for cost effective, but yet ultraprecise assembly processes. Costs are mainly driven by the final assembly requirements of laser systems. Most challenging in this context is the robust process control of the UV-curing adhesive bonding process. The work presented aims for a significant reduction of the impact of shrinkage effects during curing and a resulting increase in assembly precision. Key approaches are integrated and characterized curing systems, ultraprecise dispensing processes and the automated characterization of adhesive shrinkage magnitude. These technologies allow for reproducible adhesive bonding processes in prototyping, job-shop assembly and automated assembly cells.

Paper Details

Date Published: 25 May 2017
PDF: 1 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850E (25 May 2017); doi: 10.1117/12.2253595
Show Author Affiliations
Tobias Müller, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
Aixemtec GmbH (Germany)
Andreas Beleke, Aixemtec GmbH (Germany)
Sebastian Haag, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
Aixemtec GmbH (Germany)
Daniel Zontar, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
Sebastian Sauer, Fraunhofer Institute for Production Technology IPT (Germany)
Christoph Baum, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
Christian Brecher, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
Christian Wenzel, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)


Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)

© SPIE. Terms of Use
Back to Top