Share Email Print
cover

Proceedings Paper

Individualized FAC on bottom tab subassemblies to minimize adhesive gap between emitter and optics
Author(s): Sebastian Sauer; Tobias Müller; Sebastian Haag; Andreas Beleke; Daniel Zontar; Christoph Baum; Christian Brecher
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

High Power Diode Laser (HPDL) systems with short focal length fast-axis collimators (FAC) require submicron assembly precision. Conventional FAC-Lens assembly processes require adhesive gaps of 50 microns or more in order to compensate for component tolerances (e.g. deviation of back focal length) and previous assembly steps.

In order to control volumetric shrinkage of fast-curing UV-adhesives shrinkage compensation is mandatory. The novel approach described in this paper aims to minimize the impact of volumetric shrinkage due to the adhesive gap between HPDL edge emitters and FAC-Lens. Firstly, the FAC is actively aligned to the edge emitter without adhesives or bottom tab. The relative position and orientation of FAC to emitter are measured and stored.

Consecutively, an individual subassembly of FAC and bottom tab is assembled on Fraunhofer IPT’s mounting station with a precision of ±1 micron.

Translational and lateral offsets can be compensated, so that a narrow and uniform glue gap for the consecutive bonding process of bottom tab to heatsink applies (Figure 4). Accordingly, FAC and bottom tab are mounted to the heatsink without major shrinkage compensation.

Fraunhofer IPT’s department assembly of optical systems and automation has made several publications regarding active alignment of FAC lenses [SPIE LASE 8241-12], volumetric shrinkage compensation [SPIE LASE 9730-28] and FAC on bottom tab assembly [SPIE LASE 9727-31] in automated production environments. The approach described in this paper combines these and is the logical continuation of that work towards higher quality of HPDLs.

Paper Details

Date Published: 24 February 2017
PDF: 8 pages
Proc. SPIE 10086, High-Power Diode Laser Technology XV, 100860U (24 February 2017); doi: 10.1117/12.2253592
Show Author Affiliations
Sebastian Sauer, Fraunhofer Institute for Production Technology (Germany)
Tobias Müller, Fraunhofer Institute for Production Technology (Germany)
Sebastian Haag, Aixemtec GmbH (Germany)
Andreas Beleke, Aixemtec GmbH (Germany)
Daniel Zontar, Fraunhofer Institute for Production Technology (Germany)
Christoph Baum, Fraunhofer Institute for Production Technology (Germany)
Christian Brecher, Fraunhofer Institute for Production Technology (Germany)


Published in SPIE Proceedings Vol. 10086:
High-Power Diode Laser Technology XV
Mark S. Zediker, Editor(s)

Video Presentation

Individualized-FAC-on-bottom-tab-subassemblies-to-minimize-adhesive-gap



© SPIE. Terms of Use
Back to Top