Share Email Print
cover

Proceedings Paper

Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography
Author(s): A. Schleunitz; J. J. Klein; A. Krupp; B. Stender; R. Houbertz; G. Gruetzner
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

Paper Details

Date Published: 20 February 2017
PDF: 7 pages
Proc. SPIE 10109, Optical Interconnects XVII, 1010905 (20 February 2017); doi: 10.1117/12.2252318
Show Author Affiliations
A. Schleunitz, micro resist technology GmbH (Germany)
J. J. Klein, micro resist technology GmbH (Germany)
A. Krupp, Multiphoton Optics GmbH (Germany)
B. Stender, Multiphoton Optics GmbH (Germany)
R. Houbertz, Multiphoton Optics GmbH (Germany)
G. Gruetzner, micro resist technology GmbH (Germany)


Published in SPIE Proceedings Vol. 10109:
Optical Interconnects XVII
Henning Schröder; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top