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Proceedings Paper

Latest advances in machining of transparent, brittle materials using non-ablative femtosecond laser processing from Spectra-Physics
Author(s): F. Hendricks; B. Bernard; V. Matylitsky
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Paper Abstract

Non-ablative, femtosecond laser process ClearShapeTM from Spectra-Physics for cutting transparent, brittle materials is based on producing a micron-sized material modification track with well-defined geometry. Although this process allows cutting by using relatively low average power of 4 W, for further improvement of the process we have studied how to make an efficient usage of higher average power and higher pulse energy available from an industrial femtosecond laser systems. In this paper, we give an overview of the machining results obtained using femtosecond Spirit HE. The high average power (<16 W) and high pulse energy (<120 μJ/pule) from Spirit HE allow us to achieve unprecedented cutting speed and quality for wide variety of transparent, brittle materials.

Paper Details

Date Published: 17 February 2017
PDF: 5 pages
Proc. SPIE 10094, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVII, 1009417 (17 February 2017); doi: 10.1117/12.2252083
Show Author Affiliations
F. Hendricks, Spectra-Physics (Austria)
B. Bernard, Spectra-Physics (Austria)
V. Matylitsky, Spectra-Physics (Austria)


Published in SPIE Proceedings Vol. 10094:
Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVII
Alexander Heisterkamp; Peter R. Herman; Michel Meunier; Roberto Osellame, Editor(s)

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