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Proceedings Paper

The integration of InGaP LEDs with CMOS on 200 mm silicon wafers
Author(s): Bing Wang; Kwang Hong Lee; Cong Wang; Yue Wang; Riko I. Made; Wardhana Aji Sasangka; Viet Cuong Nguyen; Kenneth Eng Kian Lee; Chuan Seng Tan; Soon Fatt Yoon; Eugene A. Fitzgerald; Jurgen Michel
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Paper Abstract

The integration of photonics and electronics on a converged silicon CMOS platform is a long pursuit goal for both academe and industry. We have been developing technologies that can integrate III-V compound semiconductors and CMOS circuits on 200 mm silicon wafers. As an example we present our work on the integration of InGaP light-emitting diodes (LEDs) with CMOS. The InGaP LEDs were epitaxially grown on high-quality GaAs and Ge buffers on 200 mm (100) silicon wafers in a MOCVD reactor. Strain engineering was applied to control the wafer bow that is induced by the mismatch of coefficients of thermal expansion between III-V films and silicon substrate. Wafer bonding was used to transfer the foundry-made silicon CMOS wafers to the InGaP LED wafers. Process trenches were opened on the CMOS layer to expose the underneath III-V device layers for LED processing. We show the issues encountered in the 200 mm processing and the methods we have been developing to overcome the problems.

Paper Details

Date Published: 20 February 2017
PDF: 8 pages
Proc. SPIE 10107, Smart Photonic and Optoelectronic Integrated Circuits XIX, 101070Y (20 February 2017); doi: 10.1117/12.2252030
Show Author Affiliations
Bing Wang, Singapore-MIT Alliance (Singapore)
Kwang Hong Lee, Singapore-MIT Alliance (Singapore)
Cong Wang, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Yue Wang, Singapore-MIT Alliance (Singapore)
Riko I. Made, Singapore-MIT Alliance (Singapore)
Wardhana Aji Sasangka, Singapore-MIT Alliance (Singapore)
Viet Cuong Nguyen, Singapore-MIT Alliance (Singapore)
Kenneth Eng Kian Lee, Singapore-MIT Alliance (Singapore)
Chuan Seng Tan, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Soon Fatt Yoon, Singapore-MIT Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Eugene A. Fitzgerald, Singapore MIT Alliance (Singapore)
Massachusetts Institute of Technology (Singapore)
Jurgen Michel, Singapore MIT Alliance (Singapore)
Massachusetts Institute of Technology (Singapore)


Published in SPIE Proceedings Vol. 10107:
Smart Photonic and Optoelectronic Integrated Circuits XIX
Louay A. Eldada; El-Hang Lee; Sailing He, Editor(s)

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