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Proceedings Paper

Hybrid integration of VCSELs onto a silicon photonic platform for biosensing application
Author(s): Huihui Lu; Jun Su Lee; Yan Zhao; Paolo Cardile; Aidan Daly; Lee Carroll; Peter O'Brien
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Paper Abstract

This paper presents a technology of hybrid integration vertical cavity surface emitting lasers (VCSELs) directly on silicon photonics chip. By controlling the reflow of the solder balls used for electrical and mechanical bonding, the VCSELs were bonded at 10 degree to achieve the optimum angle-of-incidence to the planar grating coupler through vision based flip-chip techniques. The 1 dB discrepancy between optical loss values of flip-chip passive assembly and active alignment confirmed that the general purpose of the flip-chip design concept is achieved. This hybrid approach of integrating a miniaturized light source on chip opens the possibly of highly compact sensor system, which enable future portable and wearable diagnostics devices.

Paper Details

Date Published: 17 February 2017
PDF: 6 pages
Proc. SPIE 10072, Optical Diagnostics and Sensing XVII: Toward Point-of-Care Diagnostics, 100720K (17 February 2017); doi: 10.1117/12.2250859
Show Author Affiliations
Huihui Lu, Tyndall National Institute (Ireland)
Jun Su Lee, Tyndall National Institute (Ireland)
Yan Zhao, Tyndall National Institute (Ireland)
Paolo Cardile, Univ. Gent (Belgium)
Aidan Daly, Vertilas GmbH (Germany)
Lee Carroll, Tyndall National Institute (Ireland)
Peter O'Brien, Tyndall National Institute (Ireland)


Published in SPIE Proceedings Vol. 10072:
Optical Diagnostics and Sensing XVII: Toward Point-of-Care Diagnostics
Gerard L. Coté, Editor(s)

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