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Proceedings Paper

Thermal characteristics of compact conduction-cooled high power diode laser array packages
Author(s): Pu Zhang; Xingsheng Liu; Qiwen Zhu; Jingwei Wang
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Paper Abstract

Thermal management is one of the most important factors affecting the performance of high power diode lasers. In this paper, transient thermal behavior of conduction-cooled high power diode lasers has been studied using finite element method. The effects of heat sink geometry, ceramics size on the junction temperature of high power diode laser packages have been analyzed. Based on the simulations, heat dissipation capability of high power diode laser packages is improved and compact conduction-cooled diode laser array packages with 3 bars and 5 bars are fabricated. The power ~ current and spectrum of the optimized high power diode laser array packages at different operation parameters are characterized at different pulse widths, repetition frequencies and TEC temperatures. The effects of temperature on the output power and spectrum are discussed. The lifetime test of high power diode laser array packages is also performed. It shows that the conduction-cooled high power diode laser array packages have good optical performance.

Paper Details

Date Published: 22 February 2017
PDF: 9 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850A (22 February 2017); doi: 10.1117/12.2250258
Show Author Affiliations
Pu Zhang, Xi'an Institute of Optics and Precision Mechanics (China)
Xingsheng Liu, Xi'an Institute of Optics and Precision Mechanics (China)
Focuslight Technologies Co., Ltd. (China)
Qiwen Zhu, Xi'an Institute of Optics and Precision Mechanics (China)
Jingwei Wang, Focuslight Technologies Co., Ltd. (China)


Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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