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Proceedings Paper

Cost-effective light-emission optical sub-assembly for datacenter networks
Author(s): T. Suzuki; K. Adachi; K. R. Tamura; A. Nakanishi; K. Naoe; K. Nakahara; S. Tanaka
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Paper Abstract

Technologies for creating cost-effective light-emission optical sub-assemblies (OSAs) are discussed from the point of view of laser diodes. A lens-integrated surface-emitting laser (LISEL), consisting of a DFB laser, integrated mirror, and integrated convex lens, has the potential to achieve light-emission OSAs. An OSA based on the LISEL is proposed, and the capabilities of direct and passively aligned optical coupling, isolator-free operation, non-hermetic packaging, and on-wafer testing are introduced.

Paper Details

Date Published: 28 January 2017
PDF: 7 pages
Proc. SPIE 10131, Next-Generation Optical Networks for Data Centers and Short-Reach Links IV, 101310B (28 January 2017); doi: 10.1117/12.2249971
Show Author Affiliations
T. Suzuki, Oclaro Japan, Inc. (Japan)
K. Adachi, Oclaro Japan, Inc. (Japan)
K. R. Tamura, Oclaro Japan, Inc. (Japan)
A. Nakanishi, Oclaro Japan, Inc. (Japan)
K. Naoe, Oclaro Japan, Inc. (Japan)
K. Nakahara, Oclaro Japan, Inc. (Japan)
S. Tanaka, Oclaro Japan, Inc. (Japan)


Published in SPIE Proceedings Vol. 10131:
Next-Generation Optical Networks for Data Centers and Short-Reach Links IV
Atul K. Srivastava, Editor(s)

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