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Proceedings Paper

Integration and modeling of photonic devices suitable for high performance computing and data center applications
Author(s): B. Szelag; M. A. Seyedi; A. Myko; B. Blampey; A. Descos; Chin-Hui Chen; S. Brision; F. Gays; M. Fiorentino; Ray Beausoleil; C. Kopp
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Paper Abstract

We report a 200 mm silicon photonic platform integrating a set of devices dedicated on HPC applications. PiN microring modulator layout and process are optimized together. Active tuning through heating section is investigated using either doped silicon or metal resistors. This technology is supported by a dedicated process design kit (PDK) compatible with conventional CMOS EDA tools. The PDK includes optical device models that will be described and compared with experimental results. A focus will be done on the PiN micro-ring modulator models which covering a wide range of geometries. DC mode and RF behaviors are supported.

Paper Details

Date Published: 20 February 2017
PDF: 10 pages
Proc. SPIE 10108, Silicon Photonics XII, 1010819 (20 February 2017); doi: 10.1117/12.2249851
Show Author Affiliations
B. Szelag, Univ. Grenoble Alpes (France)
CEA-LETI (France)
M. A. Seyedi, Hewlett-Packard Labs. (United States)
A. Myko, Univ. Grenoble Alpes (France)
CEA-LETI (France)
B. Blampey, Univ. Grenoble Alpes (France)
CEA-LETI (France)
A. Descos, Hewlett-Packard Labs. (United States)
Chin-Hui Chen, Hewlett-Packard Labs. (United States)
S. Brision, Univ. Grenoble Alpes (France)
CEA-LETI (France)
F. Gays, Univ. Grenoble Alpes (France)
CEA-LETI (France)
M. Fiorentino, Hewlett-Packard Labs. (United States)
Ray Beausoleil, Hewlett-Packard Labs. (United States)
C. Kopp, Univ. Grenoble Alpes (France)
CEA-LETI (France)


Published in SPIE Proceedings Vol. 10108:
Silicon Photonics XII
Graham T. Reed; Andrew P. Knights, Editor(s)

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