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Proceedings Paper

Laser subtractive-additive-welding microfabrication for Lab-On-Chip (LOC) applications
Author(s): Linas Jonušauskas; Sima Rekštytė; Ričardas Buivydas; Simas Butkus; Domas Paipulas; Roaldas Gadonas; Saulius Juodkazis; Mangirdas Malinauskas
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Paper Abstract

An approach employing ultrafast laser hybrid microfabrication combining ablation, 3D nanolithography and welding is proposed for the realization of Lab-On-Chip (LOC) device. The same laser setup is shown to be suitable for fabricating microgrooves in glass slabs, polymerization of fine meshes inside them, and, lastly, sealing the whole chip with cover glass into one monolithic piece. The created micro fluidic device proved its particle sorting function by separating 1 μm and 10 μm polystyrene spheres from a mixture. Next, a lens adapter for a cell phone's camera was manufactured via thermal extrusion 3D printing technique which allowed to achieve sufficient magnification to clearly resolve <10 μm features. All together shows fs-laser microfabrication technology as a flexible and versatile tool for study and manufacturing of Lab-On-Chip devices.

Paper Details

Date Published: 20 February 2017
PDF: 10 pages
Proc. SPIE 10115, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics X, 101150V (20 February 2017); doi: 10.1117/12.2249828
Show Author Affiliations
Linas Jonušauskas, Vilnius Univ. (Lithuania)
Femtika (Lithuania)
Sima Rekštytė, Vilnius Univ. (Lithuania)
Ričardas Buivydas, Swinburne Univ. of Technology (Australia)
Australian National Fabrication Facility (Australia)
Simas Butkus, Vilnius Univ. (Lithuania)
Domas Paipulas, Vilnius Univ. (Lithuania)
Roaldas Gadonas, Vilnius Univ. (Lithuania)
Femtika (Lithuania)
Saulius Juodkazis, Swinburne Univ. of Technology (Australia)
Australian National Fabrication Facility (Australia)
Mangirdas Malinauskas, Vilnius Univ. (Lithuania)


Published in SPIE Proceedings Vol. 10115:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics X
Georg von Freymann; Winston V. Schoenfeld; Raymond C. Rumpf, Editor(s)

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