Share Email Print
cover

Proceedings Paper

Thermal and electrical comparison of different joining techniques
Author(s): J. Szałapak; K. Kiełbasiński; J. Krzemiński; R. Pawłowski; M. Jakubowska
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

After the enforcement of Restriction of Hazardous Substances Directive, one of the biggest problems in electronics is finding a substitution for led solders. Meanwhile, working conditions for the electronics are tougher and tougher – the temperatures the joints have to withstand can be much higher than working temperatures of the soft solders. In current article, the authors present the Low Temperature Joining Technique (LTJT) with the use of pastes based on the mixture of silver nanoparticles and silver microflakes. The authors also show the technology of joining, justify their sintering parameters selection and compare their silver joints with Pb solder and adhesive. The joints prepared with pastes containing silver nanoparticles have much better electrical and thermal properties than the ones made with other techniques.

Paper Details

Date Published: 28 September 2016
PDF: 7 pages
Proc. SPIE 10031, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016, 1003107 (28 September 2016); doi: 10.1117/12.2248619
Show Author Affiliations
J. Szałapak, Warsaw Univ. of Technology (Poland)
Institute of Electronic Materials Technology (Poland)
K. Kiełbasiński, Institute of Electronic Materials Technology (Poland)
J. Krzemiński, Warsaw Univ. of Technology (Poland)
R. Pawłowski, Abraxas Olgierd Jeremiasz (Poland)
M. Jakubowska, Warsaw Univ. of Technology (Poland)
Institute of Electronic Materials Technology (Poland)


Published in SPIE Proceedings Vol. 10031:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016
Ryszard S. Romaniuk, Editor(s)

© SPIE. Terms of Use
Back to Top