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Proceedings Paper

Design of an LVDS to USB3.0 adapter and application
Author(s): Xiaohan Qiu; Yu Wang; Xin Zhao; Zhen Chang; Quan Zhang; Yuze Tian; Yunyi Zhang; Fang Lin; Wenqing Liu
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Paper Abstract

USB 3.0 specification was published in 2008. With the development of technology, USB 3.0 is becoming popular. LVDS(Low Voltage Differential Signaling) to USB 3.0 Adapter connects the communication port of spectrometer device and the USB 3.0 port of a computer, and converts the output of an LVDS spectrometer device data to USB. In order to adapt to the changing and developing of technology, LVDS to USB3.0 Adapter was designed and developed based on LVDS to USB2.0 Adapter. The CYUSB3014, a new generation of USB bus interface chip produced by Cypress and conforming to USB3.0 communication protocol, utilizes GPIF-II (GPIF, general programmable interface) to connect the FPGA and increases effective communication speed to 2Gbps. Therefore, the adapter, based on USB3.0 technology, is able to connect more spectrometers to single computer and provides technical basis for the development of the higher speed industrial camera. This article describes the design and development process of the LVDS to USB3.0 adapter.

Paper Details

Date Published: 25 October 2016
PDF: 8 pages
Proc. SPIE 10156, Hyperspectral Remote Sensing Applications and Environmental Monitoring and Safety Testing Technology, 101560Z (25 October 2016); doi: 10.1117/12.2246608
Show Author Affiliations
Xiaohan Qiu, Anhui Institute of Optics and Fine Mechanics (China)
Univ. of Science and Technology of China (China)
Yu Wang, Anhui Institute of Optics and Fine Mechanics (China)
Xin Zhao, Anhui Institute of Optics and Fine Mechanics (China)
Zhen Chang, Anhui Institute of Optics and Fine Mechanics (China)
Univ. of Science and Technology of China (China)
Quan Zhang, Anhui Institute of Optics and Fine Mechanics (China)
Univ. of Science and Technology of China (China)
Yuze Tian, Univ. of Science and Technology of China (China)
Yunyi Zhang, Anhui Institute of Optics and Fine Mechanics (China)
Univ. of Science and Technology of China (China)
Fang Lin, Univ. of Science and Technology of China (China)
Wenqing Liu, Anhui Institute of Optics and Fine Mechanics (China)


Published in SPIE Proceedings Vol. 10156:
Hyperspectral Remote Sensing Applications and Environmental Monitoring and Safety Testing Technology

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