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Proceedings Paper

Focal plane array detectors with micro-bolometer structure and its application in IR and THz imaging
Author(s): Jun Wang; Wenchao Mou; Jun Gou; Yadong Jiang
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Paper Abstract

Focal Plane Array (FPA) detector has characteristics of low cost, operating at room temperature, compatibility with the silicon CMOS technology, and high detecting performance, therefore it becomes a hot spot in infrared (IR) or terahertz (THz) detect field recently. However, the tradition structure of micro-bolometer has the conflict of the pixel size and thermal performance. In order to improve the detecting performance of small pixel size bolometer, high fill factor and low thermal conductance design should be considered. In IR detecting, double layers structure is an efficient method to improve the absorption of micro-bolometer and reduce thermal conductance. The three-dimension model of small size micro-bolometer was built in this article. The thermal and mechanical characters of those models were simulated and optimized, and finally the double layer structure micro-bolometer was fabricated with multifarious semiconductor recipes on the readout integrated chip wafer. For THz detecting, to improve the detecting performance, different dimension THz detectors based on micro-bridge structure were designed and fabricated to get optimizing micro-bolometer parameters from the test results of membrane deformation. A nanostructured titanium thin film absorber is integrated in the micro-bridge structure of the VOx micro-bolometer to enhance the absorption of THz radiation. Continuous-wave THz detection and imaging are demonstrated with a 2.52 THz far infrared CO2 laser and fabricated 320×240 vanadium oxide micro-bolometer focal plane array with optimized cell structure. With this detecting system, THz imaging of metal concealed in wiping cloth and envelope is demonstrated.

Paper Details

Date Published: 25 October 2016
PDF: 7 pages
Proc. SPIE 10157, Infrared Technology and Applications, and Robot Sensing and Advanced Control, 101571I (25 October 2016); doi: 10.1117/12.2246504
Show Author Affiliations
Jun Wang, State Key Lab. of Electronic Thin Films and Integrated Devices (China)
Univ. of Electronic Science and Technology of China (China)
Wenchao Mou, Univ. of Electronic Science and Technology of China (China)
Jun Gou, Univ. of Electronic Science and Technology of China (China)
Yadong Jiang, State Key Lab. of Electronic Thin Films and Integrated Devices (China)
Univ. of Electronic Science and Technology of China (China)


Published in SPIE Proceedings Vol. 10157:
Infrared Technology and Applications, and Robot Sensing and Advanced Control

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