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Proceedings Paper

A new flexible hybrid mask for contact exposure and its fabrication
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Paper Abstract

According to the exposure pattern distortion in contact printing caused by the photoresist and sometimes has a rough surface with impurity particles on it, we propose a new flexible hybrid mask for contact printing. The mask consists of three layers: a flexible polymer buffer layer, a polymer structure layer of high Young's modulus, and a metal masking layer. Because the hybrid mask skillfully combines the characteristics of flexible polymer and high Young's modulus polymer, it has two advantages: high flexibility and high resolution. The flexible hybrid mask can attach closely with the photoresist under the condition of vacuum adsorption. So the fabrication of micro-nano structures with high precision and high resolution can be realized. In this paper, a new flexible hybrid mask with critical dimension of 2um was fabricated. The photoresist structure with high precision was manufactured using this mask by photolithography and it verified the feasibility of the mask for lithography.

Paper Details

Date Published: 25 October 2016
PDF: 6 pages
Proc. SPIE 9685, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials, 96850Q (25 October 2016); doi: 10.1117/12.2245719
Show Author Affiliations
Xin Liu, Institute of Optics and Electronics (China)
Man Zhang, Institute of Optics and Electronics (China)
A-xiu Cao, Institute of Optics and Electronics (China)
Hui Pang, Institute of Optics and Electronics (China)
Jia-zhou Wang, Institute of Optics and Electronics (China)
Qi-ling Deng, Institute of Optics and Electronics (China)


Published in SPIE Proceedings Vol. 9685:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials
Xiangang Luo; Tianchun Ye; Tingwen Xin; Song Hu; Minghui Hong; Min Gu, Editor(s)

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