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Proceedings Paper

Research on high-temperature sensing characteristics based on modular interference of single-mode multimode single-mode fiber
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Paper Abstract

Application of high temperature fiber sensing system is very extensive. It can be mainly used in high temperature test aerospace, such as, materials, chemicals, and energy. In recent years, various on-line optical fiber interferometric sensors based on modular interference of single-mode-multimode-single-mode(SMS) fiber have been largely explored in high temperature fiber sensor. In this paper we use the special fiber of a polyimide coating, its sensor head is composed of a section of multimode fiber spliced in the middle of Single-mode fiber. When the light is launched into the multimode fiber(MMF) through the lead-in single-mode fiber(SMF), the core mode and cladding modes are excited and propagate in the MMF respectively. Then, at the MMF-SMF spliced point, the excited cladding modes coupled back into the core of lead-out SMF interfere with SMF core mode. And the wavelength of the interference dip would shift differently with the variation of the temperature. By this mean, we can achieve the measurement of temperature. The experimental results also show that the fiber sensor based on SMS structure has a highly temperature sensitivity. From 30℃ to 300℃, with the temperature increasing, the interference dip slightly shifts toward longer wavelength and the temperature sensitivity coefficient is 0.0115nm/℃. With high sensitivity, simple structure, immunity to electromagnetic interferences and a good linearity of the experimental results, the structure has an excellent application prospect in engineering field.

Paper Details

Date Published: 14 November 2016
PDF: 6 pages
Proc. SPIE 10025, Advanced Sensor Systems and Applications VII, 1002519 (14 November 2016); doi: 10.1117/12.2245525
Show Author Affiliations
Zhaozhuang Peng, Beijing Univ. of Technology (China)
Li Wang, Beijing Univ. of Technology (China)
Huanhuan Yan, Beijing Univ. of Technology (China)


Published in SPIE Proceedings Vol. 10025:
Advanced Sensor Systems and Applications VII
Tiegen Liu; Shibin Jiang; Rene Landgraf, Editor(s)

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