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Proceedings Paper

Thickness measurement of transparent film by white-light interferometry
Author(s): Qinyuan Deng; Yi Zhou; Junbo Liu; Jingwei Yao; Song Hu
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Paper Abstract

White-light scanning interferometry plays an important role in precise profile metrology of microstructure. However, applying this approach may also be limited because of the optical reflection behavior of the surface. While there is a thin film on the surface, the reflection behavior of top and bottom of the thin-film will cause severer phase errors. Recently, the method by combining both reflectometry and white-light scanning interferometry is proposed to measure the film thickness and surface profile. This article firstly explains the principle of the proposed method and then verifies the feasibility of the thickness-measurement method for transparent film on a Silicon surface. Both of the algorithm and the experiment system have been optimized to measure the film thickness with high precision.

Paper Details

Date Published: 25 October 2016
PDF: 7 pages
Proc. SPIE 9685, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials, 968506 (25 October 2016); doi: 10.1117/12.2243601
Show Author Affiliations
Qinyuan Deng, Institute of Optics and Electronics (China)
Univ. of Chinese Academy of Sciences (China)
Yi Zhou, Institute of Optics and Electronics (China)
Univ. of Chinese Academy of Sciences (China)
Junbo Liu, Institute of Optics and Electronics (China)
Jingwei Yao, Institute of Optics and Electronics (China)
Univ. of Chinese Academy of Sciences (China)
Song Hu, Institute of Optics and Electronics (China)


Published in SPIE Proceedings Vol. 9685:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials
Xiangang Luo; Tianchun Ye; Tingwen Xin; Song Hu; Minghui Hong; Min Gu, Editor(s)

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