Share Email Print
cover

Proceedings Paper

Workflow improvements using thru-pellicle photomask repair with an optimized objective down to 10nm node
Author(s): Daniel Yi; Tod E. Robinson; Jeff LeClaire; David W. Doerr; Roy L. White; Junior Lin; Ching-Chih Chung; Rick Lai; Jong-Yuh Chang; Laurent C. Tuo; Ron R. Bozak
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 9985, Photomask Technology 2016, ; doi: 10.1117/12.2242893
Show Author Affiliations
Daniel Yi, RAVE, LLC (United States)
Tod E. Robinson, RAVE, LLC (United States)
Jeff LeClaire, RAVE, LLC (United States)
David W. Doerr, RAVE, LLC (United States)
Roy L. White, RAVE, LLC (United States)
Junior Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Ching-Chih Chung, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Rick Lai, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jong-Yuh Chang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Laurent C. Tuo, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Ron R. Bozak, RAVE, LLC (United States)


Published in SPIE Proceedings Vol. 9985:
Photomask Technology 2016
Bryan S. Kasprowicz; Peter D. Buck, Editor(s)

© SPIE. Terms of Use
Back to Top