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Proceedings Paper

Carbon dioxide gas purification and analytical measurement for leading edge mask and wafer cleaning
Author(s): Sarah Riddle Vogt; Cristian Landoni; Chuck Applegarth; Larry Rabellino; Matt Browning; Marco Succi; Simona Pirola; Giorgio Macchi
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Paper Abstract

High pressure carbon dioxide provides a very effective alternative for cleaning integrated circuits and masks. This great cleaning ability is due to CO2 having the physical characteristics of both a liquid and a gas: like a gas, it diffuses rapidly, has near zero surface tension, very low viscosity and thus penetrates easily into mask features or deep wafer trenches and vias. As a liquid it can be utilized to clean particles and to solvate other chemicals such as alcohols and fluorinated hydrocarbons. This paper covers the analytical tests and characterizations carried out to assess impurity removal from 3.0 N CO2 (beverage grade) for its final utilization in mask cleaning applications.

Paper Details

Date Published: 5 October 2016
PDF: 7 pages
Proc. SPIE 9985, Photomask Technology 2016, 998523 (5 October 2016); doi: 10.1117/12.2241479
Show Author Affiliations
Sarah Riddle Vogt, SAES Pure Gas, Inc. (United States)
Cristian Landoni, SAES Group S.p.A. (Italy)
Chuck Applegarth, SAES Pure Gas, Inc. (United States)
Larry Rabellino, SAES Pure Gas, Inc. (United States)
Matt Browning, SAES Pure Gas, Inc. (United States)
Marco Succi, SAES Group S.p.A. (Italy)
Simona Pirola, SAES Group S.p.A. (Italy)
Giorgio Macchi, SAES Group S.p.A. (Italy)


Published in SPIE Proceedings Vol. 9985:
Photomask Technology 2016
Bryan S. Kasprowicz; Peter D. Buck, Editor(s)

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