Share Email Print
cover

Proceedings Paper

The CD control improvement by using CDSEM 2D measurement of complex OPC patterns
Author(s): William Chou; Jeffrey Cheng; Adder Lee; James Cheng; Alex CP Tzeng; Colbert Lu; Ray Yang; Hong Jen Lee; Hideaki Bandoh; Izumi Santo; Hao Zhang; Chien Kang Chen
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

As the process node becomes more advanced, the accuracy and precision in OPC pattern CD are required in mask manufacturing. CD SEM is an essential tool to confirm the mask quality such as CD control, CD uniformity and CD mean to target (MTT). Unfortunately, in some cases of arbitrary enclosed patterns or aggressive OPC patterns, for instance, line with tiny jogs and curvilinear SRAF, CD variation depending on region of interest (ROI) is a very serious problem in mask CD control, even it decreases the wafer yield. For overcoming this situation, the 2-dimensional (2D) method by Holon is adopted. In this paper, we summarize the comparisons of error budget between conventional (1D) and 2D data using CD SEM and the CD performance between mask and wafer by complex OPC patterns including ILT features.

Paper Details

Date Published: 4 October 2016
PDF: 9 pages
Proc. SPIE 9985, Photomask Technology 2016, 99851M (4 October 2016); doi: 10.1117/12.2241326
Show Author Affiliations
William Chou, United Microelectronics Corp. (Taiwan)
Jeffrey Cheng, United Microelectronics Corp. (Taiwan)
Adder Lee, United Microelectronics Corp. (Taiwan)
James Cheng, United Microelectronics Corp. (Taiwan)
Alex CP Tzeng, United Microelectronics Corp. (United States)
Colbert Lu, Photronics DNP Mask Corp. (Taiwan)
Ray Yang, Photronics DNP Mask Corp. (Taiwan)
Hong Jen Lee, Photronics DNP Mask Corp. (Taiwan)
Hideaki Bandoh, Holon Corp., Ltd. (Japan)
Izumi Santo, Holon Corp., Ltd. (Japan)
Hao Zhang, Holon Corp., Ltd. (Japan)
Chien Kang Chen, Lim Chemical Co., Ltd. (Taiwan)


Published in SPIE Proceedings Vol. 9985:
Photomask Technology 2016
Bryan S. Kasprowicz; Peter D. Buck, Editor(s)

© SPIE. Terms of Use
Back to Top