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Proceedings Paper

Experimental research of improved subaperture stitching method able to eliminate high-order defocus error
Author(s): Quan Zheng; Lei Chen; Le Song; Zhigang Han
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Paper Abstract

Subaperture stitching is often adopted when measuring large size optic with interferometry method. To reduce the error of defocus in the process of stitching, an improved subaperture stitching method which can eliminate the high-order defocus error is presented based on the experimental study of defocused wavefront. Through detecting the wavefront difference with variable defocus, the actual defocus wavefront is proposed to replace the traditional paraboloid defocus basement so as to realize eliminating high-order defocus. A reflector sample is tested, the roughness parameter Ra is 1.252nm and 0.403nm respectively using the paraboloid and the actual decocus wavefront as the basement. The amendatory defocus basis is taken into the subaperture stitching process, for the two subaperture wavefront, different area of the actual defocus wavefront is used. A SiC super-smooth surface is measured with the improved subaperture stitching method, the Ra is 0.236nm after eliminating high-order defocus. Results show that it is a useful way to erase high-order defocus error without changing the low frequency information of test wavefront.

Paper Details

Date Published: 27 September 2016
PDF: 8 pages
Proc. SPIE 9684, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test, Measurement Technology, and Equipment, 968415 (27 September 2016); doi: 10.1117/12.2241147
Show Author Affiliations
Quan Zheng, Nanjing Univ. of Science and Technology (China)
Lei Chen, Nanjing Univ. of Science and Technology (China)
Le Song, Nanjing Univ. of Science and Technology (China)
Zhigang Han, Nanjing Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 9684:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test, Measurement Technology, and Equipment
Yudong Zhang; Fan Wu; Ming Xu; Sandy To, Editor(s)

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