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Paper Abstract
The mask composition checking flow is an evolution of the traditional mask rule check (MRC). In order to differentiate
the flow from MRC, we call it Mask Data Correctness Check (MDCC). The mask house does MRC only to identify
process limitations including writing, etching, metrology, etc. There still exist many potential errors that could occur
when the frame, main circuit and dummies all together form a whole reticle. The MDCC flow combines the design rule
check (DRC) and MRC concepts to adapt to the complex patterns in today’s wafer production technologies. Although
photomask data has unique characteristics, the MRC tool in Calibre® MDP can easily achieve mask composition by using
the Extended MEBES job deck (EJB) format. In EJB format, we can customize the combination of any input layers
in an IC design layout format, such as OASIS. Calibre MDP provides section-based processing for many standard verification
rule format (SVRF) commands that support DRC-like checks on mask data. Integrating DRC-like checking with
EJB for layer composition, we actually perform reticle-level DRC, which is the essence of MDCC. The flow also provides
an early review environment before the photomask pattern files are available. Furthermore, to incorporate the
MDCC in our production flow, runtime is one of the most important indexes we consider. When the MDCC is included
in the tape-out flow, the runtime impact is very limited. Calibre, with its multi-threaded processes and good scalability, is
the key to achieving acceptable runtime. In this paper, we present real case runtime data for 28nm and 14nm technology
nodes, and prove the practicability of placing MDCC into mass production.
Paper Details
Date Published: 10 May 2016
PDF: 5 pages
Proc. SPIE 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology, 99840D (10 May 2016); doi: 10.1117/12.2240292
Published in SPIE Proceedings Vol. 9984:
Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology
Nobuyuki Yoshioka, Editor(s)
PDF: 5 pages
Proc. SPIE 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology, 99840D (10 May 2016); doi: 10.1117/12.2240292
Show Author Affiliations
Shou-Yuan Ma, Mentor Graphics Corp. (Taiwan)
Chuen-Huei Yang, United Microelectronics Corp. (Taiwan)
Joe Tsai, United Microelectronics Corp. (Taiwan)
Alice Wang, United Microelectronics Corp. (Taiwan)
Roger Lin, United Microelectronics Corp. (Taiwan)
Rachel Lee, United Microelectronics Corp. (Taiwan)
Erwin Deng, United Microelectronics Corp. (Taiwan)
Chuen-Huei Yang, United Microelectronics Corp. (Taiwan)
Joe Tsai, United Microelectronics Corp. (Taiwan)
Alice Wang, United Microelectronics Corp. (Taiwan)
Roger Lin, United Microelectronics Corp. (Taiwan)
Rachel Lee, United Microelectronics Corp. (Taiwan)
Erwin Deng, United Microelectronics Corp. (Taiwan)
Ling-Chieh Lin, Mentor Graphics Corp. (Taiwan)
Hung-Yueh Liao, Mentor Graphics Corp. (Taiwan)
Jenny Tsai, Mentor Graphics Corp. (United States)
Amanda Bowhill, Mentor Graphics Corp. (United States)
Hien Vu, Mentor Graphics Corp. (United States)
Gordon Russell, Mentor Graphics Corp. (United States)
Hung-Yueh Liao, Mentor Graphics Corp. (Taiwan)
Jenny Tsai, Mentor Graphics Corp. (United States)
Amanda Bowhill, Mentor Graphics Corp. (United States)
Hien Vu, Mentor Graphics Corp. (United States)
Gordon Russell, Mentor Graphics Corp. (United States)
Published in SPIE Proceedings Vol. 9984:
Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology
Nobuyuki Yoshioka, Editor(s)
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