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Proceedings Paper

How heat influences CIGSSe solar cells properties
Author(s): Marco Giacomo Flammini; Nicola Debernardi; Maxime Le Ster; Klaas Bakker; Brendan Dunne; Johan Bosman; Mirjam Theelen
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Paper Abstract

Non-encapsulated CIGSSe solar cells, with a silver grid, were exposed to different temperatures for various periods in order to measure the effect of the heat exposure in CIGSSe modules. The heat treatment time and temperature were varied during the experiments, which were executed at atmospheric conditions. In all the cases, after reaching a temperature of about 300°C, the IV measurement showed a reduction of 2-3% in terms of VOC and JSC. This is confirmed respectively by Raman and EQE measurements as well. The efficiency drop was -7%, -29% and -48% respectively for 30 seconds, 300 seconds and 600 seconds of exposure time. With temperatures larger than 225°C, the series resistance starts to increase exponentially and a secondary barrier becomes visible in the IV curve. This barrier prevents the extraction of electrons and consequently reducing the solar cells efficiency. Lock-in thermography demonstrated the formation of shunts on the mechanical scribes only for 300 and 600 seconds exposure times. The shunt resistance reduction is in the range of 5% for all time periods.

Paper Details

Date Published: 26 September 2016
PDF: 11 pages
Proc. SPIE 9938, Reliability of Photovoltaic Cells, Modules, Components, and Systems IX, 99380C (26 September 2016); doi: 10.1117/12.2240266
Show Author Affiliations
Marco Giacomo Flammini, TNO (Netherlands)
Solliance (Netherlands)
Nicola Debernardi, TNO (Netherlands)
Solliance (Netherlands)
Maxime Le Ster, ECN (Netherlands)
Solliance (Netherlands)
Klaas Bakker, ECN (Netherlands)
Solliance (Netherlands)
Brendan Dunne, NEXCIS (France)
Johan Bosman, ECN (Netherlands)
Solliance (Netherlands)
Mirjam Theelen, TNO (Netherlands)
Solliance (Netherlands)


Published in SPIE Proceedings Vol. 9938:
Reliability of Photovoltaic Cells, Modules, Components, and Systems IX
Neelkanth G. Dhere; John H. Wohlgemuth; Keiichiro Sakurai, Editor(s)

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